|
Process
|
Specification
|
Reading Edge
|
|
Working size
|
Board Size |
Min. 13.4"x16"
(406 x 340mm)
|
|
|
Max. 20"x24"
(510
x 610mm)
|
|
|
Internal Layer
|
Core thickness |
Min. 2 Mils |
|
| Cu
oz |
Max. 6 oz |
Max. 12 oz |
| Line
Width & Space |
Min. 3/3 Mils
(75/75
㎛)
|
Min. 2/2 Mils
(50/50 ㎛) |
Etch
factor
|
5 |
|
|
Lamination
|
Range of layer count |
4 ~ 32 |
42 |
| Thickness
control |
+/- 10 % |
+/- 7 % |
| Layer
to Layer registration |
Max. 4 Mils
(100 ㎛) |
|
|
Drill
|
Min drill size / Land size |
8 Mils/17.8 Mils
(0.20/0.4mm) |
6 Mils/12 Mils
(0.15/0.3mm) |
| Drill
accuracy |
+/- 2Mils (50㎛) |
|
| Aspect
ratio |
12 : 1 |
|
| Roughness |
Max. 1 Mils (25㎛) |
|
|
Cu Plating
|
Board
thickness |
Min. 4 Mils (0.1mm) |
|
| Max. 126 Mils (3.2mm) |
|
Aspect
ratio
|
6.4 : 1
|
12 : 1 |
Throwing
power
|
Min. 90 % |
|
| Plating
thickness(STD. DEV) |
0.2 Mils (5 ㎛)
(Tenting)
|
|
|
External
Layer
|
Board
thickness |
Max.81.3
Mils(3.2mm) |
Max.189Mils(4.8mm) |
| Line
width & space |
Min. 3/3 Mils
(75/75 ㎛) |
Min. 2/2 Mils
(50/50 ㎛) |
| Etch
factor |
4 |
|
|
A.O.I
Inspect
|
Resolution
|
L/S:Min. 65x65 ㎛ |
|
|
Solder
Mask
|
Solder
Dam |
Min.
2Mlis (50 ㎛) |
|
| Hardness |
7H |
|
| S/R
Clearance |
Max.
1.38Mils (35㎛) |
|
|
FINISH
|
OSP
|
Coating
thick.
|
0.008 ~ 0.012 Mils
(0.2 ~ 0.3 ㎛)
|
|
|
IMMERSION
GOLD
|
Ni
thickness |
0.12 ~ 0.2 Mils
(3 ~ 5 ㎛)
|
|
| Au
thickness |
0.0012 ~ 0.003 Mils
(0.03 ~ 0.07 ㎛) |
|
|
HARD GOLD
|
Ni
thick
|
0.12 ~ 0.3 Mils
(3 ~ 8 ㎛) |
|
| Au
thick |
0.028 ~ 0.07 Mils
(0.7 ~ 1.7 ㎛) |
|
| Immersion
Tin |
Tin
thickness
|
Min. 0.01 Mils
(0.25 ㎛) |
|
Max. 0.05 Mils
(1.20 ㎛) |
|
| Immersion
Silver |
Silver
thickness |
Min. 0.003 Mils
(0.07 ㎛) |
|
Max. 0.02 Mils
(0.50 ㎛) |
|
|
PUNCH &
ROUTER
|
Dimension
Tolerance |
+/- 4 Mils
(100 ㎛) |
|
|
V-cut
|
Angle
|
30, 45 degree
(“V” Type) |
|
|
ELECTRICAL
TESTER
|
Inspection
area |
Max.16”x19.”
(406x488mm) |
|
| Continuity |
50V,30Ω |
|
| Isolation |
250V,100MΩ |
|
Home > 제품소개 > Process Capability 
